henkel-logo-thumbBattery Manufacturing Materials

Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific MaterialsMaterial Processing Notes
Thermally Conductive Interface Pads
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Henkel Bergquist™ Gap Pad® VO
Henkel Bergquist™ Hi-Flow® 105
Henkel Bergquist™ Sil Pad A2000
Thermally Conductive Tapes
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • ABLEFILM