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Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific Material(s)Material Processing Notes
Antenna Materials
  • Selective ablation of active layer (sintered ferrite) from polymer carrier
  • Direct patterning of antenna design
  • No photolithography
  • No chemicals
  • Combined process – pattern antenna by selective laser ablation, and then cut to remove part from web
  • DuPont™ GreenTape™
Flexible Circuit Materials
  • Multiple material compatibility
  • Complex geometries with small features
  • Selective ablation of polymer layers from copper conductor
  • No tooling required
Insulating Films
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
Thermally Conductive Interface Pads
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
  • DuPont™ Temprion™ OHS Organic Heat Spreader
Thermally Conductive Tapes
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • DuPont™ Teprion™ AT Adhesive Thermal Tape