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Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific Material(s)Material Processing Notes
Printed CIrcuit Boards
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required
RF Substrates
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required