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Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific Material(s)Material Processing Notes
Gap Fill Materials
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
RF Substrates
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required
Thermally Conductive Tapes
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)