PLS4.75

  • PLS4.75 Platform
  • PLS4.75 Platform
  • PLS4.75 Platform
  • PLS4.75 Platform
PLS4.75 Specs

PLS4.75 Dimensional Drawings

Platform Overview

The PLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).

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Platform Specifications

PLS4.75
Laser Material Processing Area (W x H)24 x 18 in (610 x 457 mm)
Maximum Part Size (W x H x D)29 x 23 x 8.5 in (737 x 584 x 216 mm)
Overall Dimension (W x H x D)36 x 39 x 36 in (914 x 991 x 914 mm)
Rotary CapacityMax Diameter 8 in (203.2 mm)
Motorized Z Axis Lifting Capacity40 lbs (18 kg)
Available Focus Lenses2.0 in (51 mm)
HPDFO™ (High Power Density Focusing Optics)
Laser Platform Interface PanelKeypad and LCD display show current file name, laser power, engraving speed, PPI and run time.
Computer RequirementsRequires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics ProtectionIntegrated with included Gas Assist
Cabinet StyleFree-Standing
Laser Options10, 30, 40, 50, 60 and 75 watts
Weight270 lbs (122 kg)
Power Requirements110V/10A
220V-240V/5A
Exhaust RequirementsOne 4 in (102 mm) port
250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa)

Included Accessories

Optional Accessories

Platform Features


Laser Features