The ULTRA 9 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizeable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA 9 platform has a materials processing envelope of 36 x 24 in (914 x 610), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA 9 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. When the platform is configured with three lasers, users can take advantage of MultiWave HybridTM technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features include rapid, high-accuracy laser beam positioning, precision focusing with autofocus, adjustable laser power density, an automation interface, camera registration, an integrated touch screen user interface, fire detection and support for suppression.