Electronic Materials

3M

Antenna Materials
3M™ Flux Field Directional Materials (FFDM)
Potential Advantages of ULS DLMP® Solution:
  • Selective ablation of active layer (sintered ferrite) from polymer carrier
  • Direct patterning of antenna design
  • No photolithography
  • No chemicals
  • Combined process – pattern antenna by selective laser ablation, and then cut to remove part from web
Display Materials
3M™ Advanced Polarizing Film
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • No photolithography
  • No tooling required
3M™ Brightness Enhancement Film
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • No photolithography
  • No tooling required
3M™ Contrast Enhancement Film
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • No photolithography
  • No tooling required
3M™ Enhanced Specular Reflector
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • No photolithography
  • No tooling required
3M™ Optically Clear Adhesive
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • No photolithography
  • No tooling required
Electrically Conductive Tapes
3M™ Electrically Conducting Adhesive Transfer Tape (ECATT)
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
EMI Absorbers
3M™ Wide Frequency EMI Absorbers (Ab)
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
EMI Gasket Materials
3M™ Electrically Conductive Acrylic Pads (eCAP)
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
3M™ Electrically Conductive Gasket (ECG)
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
3M™ Metal Shielding Gaskets (MSG)
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
Fabric Tapes
3M™ AG 0927 – Silver-coated Polyester Fabric
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No fabric compression
  • No tooling required
3M™ AU 2190 – Gold-coated Polyester Fabric
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No fabric compression
  • No tooling required
3M™ CEF Series – Cu/Ni Plated Fabric
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No fabric compression
  • No tooling required
3M™ CN Series – Non-woven Copper-Nickel Fabric
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No fabric compression
  • No tooling required
3M™ X-7001 – Copper Plated Polyester Ripstop Fabric
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No fabric compression
  • No tooling required
Foam Tapes
3M™ VHB™ Tapes
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Foil Tapes
3M™ Aluminum Foil
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No tooling required
3M™ Aluminum Foil Laminated with Polyester Film
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No tooling required
3M™ Copper Foil
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No tooling required
3M™ Embossed Foil
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • No tooling required
Membrane Switch Spacers
3M™ Membrane Switch Spacer
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
Surface Protection Films
3M™ Anti-Glare for Smartphones
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • Complex geometries with small features
  • No tooling required
3M™ Ultra-Clear for Smartphones
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • No cracking of coatings
  • Complex geometries with small features
  • No tooling required
Thermally Conductive Interface Pads
3M 5516 – Ceramic Filled Silicone
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Thermally Conductive Tapes
3M™ Thermally Conductive Adhesive Transfer Tape
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
Transfer Tapes
3M™  Adhesive Transfer Tape 467MP
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling

DuPont

Antenna Materials
DuPont™ GreenTape™
Potential Advantages of ULS DLMP® Solution:
  • Selective ablation of active layer (sintered ferrite) from polymer carrier
  • Direct patterning of antenna design
  • No photolithography
  • No chemicals
  • Combined process – pattern antenna by selective laser ablation, and then cut to remove part from web
Flexible Circuit Materials
DuPont™ Pyralux® AC
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • Selective ablation of polymer layers from copper conductor
  • No tooling required
DuPont™ Pyralux® FR
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Complex geometries with small features
  • Selective ablation of polymer layers from copper conductor
  • No tooling required
Insulating Films
DuPont™ Kapton®
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
DuPont™ Nomex® Paper
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
Thermally Conductive Interface Pads
DuPont™ Temprion™ OHS Organic Heat Spreader
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Thermally Conductive Tapes
DuPont™ Teprion™ AT Adhesive Thermal Tape
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling

Henkel

Electrically Conductive Tapes
Emerson & Cuming CF3350
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
Thermally Conductive Interface Pads
Bergquist Gap Pad Products
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Bergquist Hi-Flow Products
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Bergquist Sil-Pad Products
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
Thermally Conductive Tapes
LOCTITE ABLESTIK ECF 563
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling

Isola

Printed CIrcuit Boards
Isola 185HR Printed Circuit Board Material
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required
RF Substrates
TerraGreen® (RF/MW)
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required

ITW Formex

Flame Retardant Materials
Formex™ – Polypropylene Electrical Insulation
Potential Advantages of ULS DLMP® Solution:
  • Multiple processes
  • Laser scoring
  • Laser cutting
  • Complex geometries with small features
  • No material compression
  • No tooling required
Statex™ – Static Dissipative Material
Potential Advantages of ULS DLMP® Solution:
  • Multiple processes
  • Laser scoring
  • Laser cutting
  • Complex geometries with small features
  • No material compression
  • No tooling required

Polyflon

RF Substrates
CuFlon
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required

Rogers

Gap Fill Materials
BISCO® Cellular Silicone
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
PORON® Microcellular Urethane
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
RF Substrates
CuClad® Laminates
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required
RO4000® LoPro® Laminates
Potential Advantages of ULS DLMP® Solution:
  • Multiple material compatibility
  • Selective ablation of copper conductor from insulating core
  • Direct patterning of circuit
  • No photolithography
  • No chemicals
  • Complex geometries with small features
  • No tooling required
Thermally Conductive Tapes
COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling

SABIC

Insulating Films
Lexan™ Film
Potential Advantages of ULS DLMP® Solution:
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required

Thorlabs

Touch Screen Materials
Thorlabs ITO-Coated PET Film
Potential Advantages of ULS DLMP® Solution:
  • Selective ablation of ITO from PET carrier
  • Direct patterning of grid array
  • No photolithography
  • No chemicals
  • Combined process – pattern grid using selective ablation, laser anneal ITO, and then cut to remove part from web