Processing Halar® Using Digital Laser Material Processing (DLMP®) Technology
Halar® and DLMP® Technology
The material properties of Halar, primarily heat and oxidation resistance, make it highly compatible with Digital Laser Material Processing (DLMP®) technology. The influence of these properties on the results of DLMP is discussed in detail in the following sections.
The effects of laser energy interaction with Halar are material ablation and material modification. In the case of Halar, the processes of laser cutting, laser engraving and laser marking can be applied. The laser energy can ablate material to cut, engrave, or mark the material, or it can change the surface properties to create a visible mark. Each of these processes are discussed in their respective section below.
Material ablation is a physical process that removes material. Material is removed completely from the top to the bottom surface or partially from the top of the material down to a specified depth.
Halar is an excellent absorber of CO2 laser energy (wavelength=10.6 μm). When Halar absorbs laser energy, it rapidly converts optical energy into molecular vibrations (heat). With sufficient heat, Halar undergoes rapid melting and vaporization, where the molecular bonds are broken at various points in its molecular structure. Material directly in the laser path is ablated away, creating vapors but no debris or discoloration. Primarily, CO2 lasers are used for laser ablation of Halar.
Laser cutting is the complete removal and separation of material from the top surface to the bottom surface along a designated path.